Polished Molybdenum Disc& Molybdenum Square
Description
Molybdenum is gray-metallic and has the third-highest melting point of any element next to tungsten and tantalum. It is found in various oxidation states in minerals but does not exist naturally as a free metal. Molybdenum allows readily to form hard and stable carbides. For this reason, Molybdenum is frequently used for making steel alloys, high strength alloys, and superalloys. Molybdenum compounds usually have a low solubility in water. Industrially, they are used in high-pressure and high-temperature applications such as pigments and catalysts.
Our Molybdenum Discs and Molybdenum Squares have a similar low coefficient of thermal expansion to silicon and high-performance machining properties. We offer both a polishing surface and a lapping surface.
Type and Size
- Standard: ASTM B386
- Material: >99.95%
- Density: >10.15g/cc
- Molybdenum disc: Diameter 7 ~ 100 mm, thickness 0.15 ~ 4.0 mm
- Molybdenum square: 25 ~ 100 mm2, thickness 0.15 ~ 1.5 mm
- Flatness tolerance: < 4um
- Roughness: Ra 0.8
| Purity(%) |
Ag |
Ni |
P |
Cu |
Pb |
N |
|
<0.0001 |
<0.0005 |
<0.001 |
<0.0001 |
<0.0001 |
<0.002 |
|
|
Si |
Mg |
Ca |
Sn |
Ba |
Cd |
|
|
<0.001 |
<0.0001 |
<0.001 |
<0.0001 |
<0.0003 |
<0.001 |
|
|
Na |
C |
Fe |
O |
H |
Mo |
|
|
<0.0024 |
<0.0033 |
<0.0016 |
<0.0062 |
<0.0006 |
>99.95 |
Features
Our company can carry out vacuum annealing treatment and leveling treatment on molybdenum plates. All the plates are subjected to cross rolling; moreover, we pay attention to the control over the grain size in the rolling process. Therefore, the plates have extremely good bending and stamping properties.
Applications
Molybdenum Discs/Squares have a similar low coefficient of thermal expansion to silicon and better machining properties. For that reason, it’s usually used for heat dissipation as an electronic component of high power and high-reliability semiconductor, contact materials in silicon controlled rectifiers diodes, transistors, and thyristors (GTO’S), mounting material for power semiconductor heat sink bases in IC’S, LSI’S, and hybrid circuits.
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