High Purity 99.95% Tungsten Sputtering Target
Type and Size
|
Product Name |
Tungsten(W-1)sputtering target |
|
Available Purity(%) |
99.95% |
|
Shape: |
Plate, round, rotary |
|
Size |
OEM size |
|
Melting point(℃) |
3407(℃) |
|
Atomic volume |
9.53 cm3/mol |
|
Density(g/cm³) |
19.35g/cm³ |
|
Temperature coefficient of resistance |
0.00482 I/℃ |
|
Sublimation heat |
847.8 kJ/mol(25℃) |
|
Latent heat of melting |
40.13±6.67kJ/mol |
|
surface state |
Polish or alkali wash |
|
Application: |
Aerospace, rare earth smelting, electric light source, chemical equipment, medical equipment, metallurgical machinery, smelting |
Features
(1) Smooth surface without pore,scratch and other imperfection
(2) Grinding or lathing edge, no cutting marks
(3) Unbeatable lerel of material purity
(4) High ductility
(5) Homogeneous micro trucalture
(6) Laser marking for your special Item with name, brand, purity size and so on
(7)Every pcs of sputtering targets from the powder materials item&number, mixing workers,outgas and HIP time,machining person and packing details are all made ourselves.
Applications
1. An important way to make thin-film material is sputtering—a new way of physical vapor deposition (PVD). The thin-film made by target is characterized by high density and good adhesiveness. As the magnetron sputtering techniques being widely applied, the high pure metal and alloy targets are in great need. Being with high melting point, elasticity, low coefficient of thermal expansion, resistivity and fine heat stability, pure tungsten and tungsten alloy targets are widely used in semiconductor integrated circuit, two-dimensional display, solar photovoltaic, X ray tube and surface engineering.
2.It can work with both older sputtering devises as well as the latest process equipments, such as large area coating for solar energy or fuel cells and flip-chip applications.
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